Vented die and package
A die that includes a substrate having a first and second major surface is disclosed. The die has at least one unfilled through via passing through the major surfaces of the substrate. The unfilled through via serves as a vent to release pressure generated during assembly.
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| Hauptverfasser: | , , |
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | A die that includes a substrate having a first and second major surface is disclosed. The die has at least one unfilled through via passing through the major surfaces of the substrate. The unfilled through via serves as a vent to release pressure generated during assembly. |
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