Integrated circuit package system having interconnect stack and external interconnect

Integrated circuit package system having interconnect stack and external interconnect

An integrated circuit package system is provided forming an integrated circuit die having a first bond pad provided thereon, forming an interconnect stack on a first external interconnect, and connecting the interconnect stack to the first bond pad.

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Bibliographische Detailangaben
Hauptverfasser: ILAGAN ALLAN, ESPIRITU EMMANUEL, CABLAO PHILIP LYNDON, FILOTEO, JR. DARIO S, ABINAN RACHEL LAYDA, MERILO LEO A
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:An integrated circuit package system is provided forming an integrated circuit die having a first bond pad provided thereon, forming an interconnect stack on a first external interconnect, and connecting the interconnect stack to the first bond pad.