Method of reworking electrical short in ultra sonic bonder

A modified ultrasonic bonding machine and process uses a sharpened bonding wedge to perform cutting of short material. The sharpened wedge is controlled by the same position control device control used to position the bonding wedge for bonding. The software is modified to permit selection of bonding...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	LOW TACK LOONG, FONG NIA W
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A modified ultrasonic bonding machine and process uses a sharpened bonding wedge to perform cutting of short material. The sharpened wedge is controlled by the same position control device control used to position the bonding wedge for bonding. The software is modified to permit selection of bonding or cutting, and the bonding wedge is replaced with a cutting wedge. The modified ultrasonic bonding machine allows the operator to use the automated system of the machine to do the cutting, and the precision gained ensures that no damage to the parts is caused by the cutting process.