Electrical contact device

An electrical contact device comprising a first contact assemblage having multiple contact pads disposed in a row which are allocated to different connection types, and having a second contact assemblage having multiple contact pads disposed in a row in accordance with a predetermined sequence, which are allocated to different connection types and having bonding wire connections that electrically connect at least some of the contact pads of the first contact assemblage to contact pads of the second contact assemblage. To reduce the outlay in terms of adaptation to different predetermined connection type allocations, it is proposed that the number and sequence of the contact pads in the first contact assemblage that are allocated to the different connection types be configured so that for at least two differently predetermined sequences of the contact pads in the second contact assemblage that are allocated to the different connection types, each of the contact pads of the second contact assemblage is to be connected in crossover-free fashion, by way of the bonding wire connections, to a contact pad of the first contact assemblage allocated to the same connection type.