Self-organized pin-type nanostructures, and production thereof on silicon

By means of an RIE etch process for silicon (3), a pin-type structure (4,4a) without crystal defects is formed with high aspect ratio and with nano dimensions on the surface of silicon wafers without any additional patterning measures (e-beam, interference lithography, and the like) by selecting the...

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Bibliographische Detailangaben
Hauptverfasser: BACH KONRAD, GAEBLER DANIEL, STUBENRAUCH MIKE, FISCHER MICHAEL
Format: Patent
Sprache:eng
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Zusammenfassung:By means of an RIE etch process for silicon (3), a pin-type structure (4,4a) without crystal defects is formed with high aspect ratio and with nano dimensions on the surface of silicon wafers without any additional patterning measures (e-beam, interference lithography, and the like) by selecting the gas components of the etch plasma in self-organization wherein, among others, a broadband antireflective behavior is obtained that may be applicable in many fields.