Printed circuit board, fabrication method and apparatus

A printed circuit board includes a mounted a first electronic component. The printed circuit board includes a first through holes extending from a mounting surface on which the electronic component is mounted. The printed circuit board includes a second through holes extending from a surface opposit...

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Bibliographische Detailangaben
1. Verfasser:	SUGINO SHIGERU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE
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Beschreibung
Zusammenfassung:	A printed circuit board includes a mounted a first electronic component. The printed circuit board includes a first through holes extending from a mounting surface on which the electronic component is mounted. The printed circuit board includes a second through holes extending from a surface opposite the mounting surface and aligned with the first through holes. A second electronic component may be longitudinally between the first through holes and the second through holes. The first and second through holes may be electrically connected with the second electronic component.