Systems and methods for passive thermal management using phase change material

Systems and methods for passive thermal management using phase change material are provided. In one embodiment, a thermal management method is provided. The method comprises securing an electronics assembly to a mounting surface using a thermally insulative support structure; insulating a phase chan...

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Bibliographische Detailangaben
Hauptverfasser:	WATSON MARK W, HELLICKSON DEAN R, RICHASON CHAD E, TUTHILL ALLEN F
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	Systems and methods for passive thermal management using phase change material are provided. In one embodiment, a thermal management method is provided. The method comprises securing an electronics assembly to a mounting surface using a thermally insulative support structure; insulating a phase change material within the support structure; and melting the phase change material to reduce heat transfer from an external environment to the electronics assembly during a high temperature transient thermal condition.