Multilayer adhesive for thermal reversible joining of substrates

One embodiment of the invention includes a multilayer dry adhesive system capable of reversible joining of rigid substrates.

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Bibliographische Detailangaben
Hauptverfasser:	KIA HAMID G, WANG RUOMIAO, SCHROEDER JESSICA A, DUROCHER TODD E, XIE TAO, XIAO XINGCHENG
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PERFORMING OPERATIONS POLISHES TRANSPORTING USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	One embodiment of the invention includes a multilayer dry adhesive system capable of reversible joining of rigid substrates.