Using cell voltage as a monitor for deposition coverage

A method and apparatus are described that use cell voltage and/or current as monitor to prevent electrochemical deposition (e.g., electroplating) tools from deplating wafers with no or poor metal (e.g., Cu) seed coverage.

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Bibliographische Detailangaben
Hauptverfasser: MA YUE, CAO YANG, CHEN JIR-SHYR, RASTOGI RAJIV
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:A method and apparatus are described that use cell voltage and/or current as monitor to prevent electrochemical deposition (e.g., electroplating) tools from deplating wafers with no or poor metal (e.g., Cu) seed coverage.