Electronic chip package with reduced contact pad pitch

An apparatus and method, the apparatus includes an electronic chip package including an electronic chip having a first and a second contact pad formed thereon, a first dielectric layer coupled to the electronic chip, a second dielectric layer coupled to the first dielectric layer such that a dielect...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MCCONNELEE PAUL ALAN, DUROCHER KEVIN M, FILLION RAYMOND ALBERT, SAIA RICHARD JOSEPH
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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