Method of manufacturing a semiconductor apparatus

A method of making a semiconductor apparatus provides a plurality of electrode pads on a main surface of a semiconductor chip, and a plurality of bump electrodes on the electrode pads. The method also provides a wired board which is allocated in a side of the main surface of the chip and is positioned in a central area of the main surface of the chip so as to be separated from an edge part of the chip by at least 50 μm or more, a plurality of external terminals on the wired board and which are electrically connected to a plurality of bump electrodes through wirings of the wired board, and a sealing part between the chip and the wired board, the sealing part being made of underfill material that covers a connection part between the bump electrode and the wiring.