Low profile computer processor retention device

A low profile computer processor retention device, the computer processor including a processor substrate and a heat spreader mounted on the processor substrate. The retention device includes a retention housing. The retention housing is shaped to fit around a socket. The retention device also inclu...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	KAMATH VINOD, JENSEN DAVID J, KERRIGAN BRIAN M, GALLARELLI PAT
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	A low profile computer processor retention device, the computer processor including a processor substrate and a heat spreader mounted on the processor substrate. The retention device includes a retention housing. The retention housing is shaped to fit around a socket. The retention device also includes a load frame. The load frame is operatively coupled to the retention housing and is configured to retain the computer processor in the socket of a motherboard with direct contact between the load frame and the processor substrate. The load frame has a cutout. The retention device also includes a heat sink fastening member coupled to the retention housing and configured to fasten a heat sink to the retention housing and configured to couple the heat sink to the heat spreader through the cutout of the load frame.