Method to provide a layer with uniform etch characteristics

The present invention includes a method and a composition to form a layer on a substrate having uniform etch characteristics. To that end, the method includes controlling variations in the characteristics of a solid layer, such etch characteristics over the area of the solid layer as a function of t...

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Bibliographische Detailangaben
Hauptverfasser:	MARTIN WESLEY D, WATTS MICHAEL P. C, XU FRANK Y, LAD PANKAJ B, WANG DAVID C, STACEY NICHOLAS A, MACKAY CHRISTOPHER J, TRUSKETT VAN N, FLETCHER EDWARD B, MCMACKIN IAN M
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL CINEMATOGRAPHY ELECTROGRAPHY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS HOLOGRAPHY MANUFACTURE OR TREATMENT OF NANOSTRUCTURES MATERIALS THEREFOR MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES NANOTECHNOLOGY ORIGINALS THEREFOR PERFORMING OPERATIONS PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES SPRAYING OR ATOMISING IN GENERAL TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TRANSPORTING
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Beschreibung
Zusammenfassung:	The present invention includes a method and a composition to form a layer on a substrate having uniform etch characteristics. To that end, the method includes controlling variations in the characteristics of a solid layer, such etch characteristics over the area of the solid layer as a function of the relative rates of evaporation of the liquid components that comprise the composition from which the solid layer is formed.