Process for cleaning a semiconductor wafer using a cleaning solution

Process for cleaning a semiconductor wafer using a cleaning solution

Semiconductor wafers are cleaned using a cleaning solution containing an alkaline ammonium component in an initial composition, wherein the semiconductor wafer is brought into contact with the cleaning solution in an individual-wafer treatment, and in the course of cleaning hydrogen fluoride is adde...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: SCHWAB GUENTER, BUSCHHARDT THOMAS, ZAPILKO CLEMENS, FEIJOO DIEGO
Format: Patent
Sprache:eng
Schlagworte:
CLEANING
CLEANING IN GENERAL
PERFORMING OPERATIONS
PREVENTION OF FOULING IN GENERAL
TRANSPORTING
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Beschreibung
Zusammenfassung:Semiconductor wafers are cleaned using a cleaning solution containing an alkaline ammonium component in an initial composition, wherein the semiconductor wafer is brought into contact with the cleaning solution in an individual-wafer treatment, and in the course of cleaning hydrogen fluoride is added as further component to the cleaning solution, and the cleaning solution has at the end of cleaning, a composition that differs from the initial composition.