Semiconductor package and manufacturing method thereof and encapsulating method thereof

A semiconductor package, a manufacturing method thereof and an encapsulating method thereof are provided. The semiconductor package includes a substrate, a flip chip, a plurality of conductive parts and a sealant. The substrate has a substrate upper surface. The flip chip has an active surface and a chip surface opposite to the active surface. The conductive parts electrically connect the substrate upper surface and the active surface. The sealant envelops the flip chip, and the space between the substrate upper surface and the active surface is filled with a portion of the sealant. The sealant further has a top surface. wherein, the chip surface is spaced apart from the top surface by a first distance, the substrate upper surface is spaced apart from the active surface by a second distance, and the ratio of the first distance to the second distance ranges from 2 to 5.