Multilevel ground-plane for a mobile device
In accordance with the teachings described herein, a multilevel ground-plane for a mobile device is provided. The multilevel ground-plane includes a first conductive surface, a second conductive surface, and a conducting strip that couples the first conducting surface to the second conducting surfac...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | In accordance with the teachings described herein, a multilevel ground-plane for a mobile device is provided. The multilevel ground-plane includes a first conductive surface, a second conductive surface, and a conducting strip that couples the first conducting surface to the second conducting surface. A mobile device having a multilevel ground-plane may include a printed circuit board, an antenna radiating element attached to a surface of the printed circuit board, and the multilevel ground plane integral with the printed circuit board and electromagnetically coupled to the antenna radiating element. |
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