Thermally insulating bonding pad structure for solder reflow connection

A thermally insulating bonding pad for solder reflow is described. The bonding pad includes a structure. The structure forms the bonding pad. The bonding pad further includes an insulator formed on the structure. The insulator is configured to be interposed between the structure and a substrate of a...

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Bibliographische Detailangaben
Hauptverfasser:	TAKAHASHI HARUHIDE, TSUCHIYA TATSUMI, HIRANO TOSHIKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS INFORMATION STORAGE INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORDCARRIER AND TRANSDUCER MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PHYSICS PRINTED CIRCUITS SEMICONDUCTOR DEVICES TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Beschreibung
Zusammenfassung:	A thermally insulating bonding pad for solder reflow is described. The bonding pad includes a structure. The structure forms the bonding pad. The bonding pad further includes an insulator formed on the structure. The insulator is configured to be interposed between the structure and a substrate of a component onto which said bonding pad is to be disposed. The bonding pad provides thermal insulation for said substrate when said bonding pad is subject to a solder reflow process being performed thereon.