Circuit board mounting backplate

Disclosed is a circuit board mounting backplate to mount a circuit board including a base unit, a tongue unit formed by bending a region enclosed by a notched groove formed at a portion of the base unit and a horizontal unit formed by bending the tongue unit at a predetermined height position so as...

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1. Verfasser: KOBAYASHI TATSUYOSHI
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:Disclosed is a circuit board mounting backplate to mount a circuit board including a base unit, a tongue unit formed by bending a region enclosed by a notched groove formed at a portion of the base unit and a horizontal unit formed by bending the tongue unit at a predetermined height position so as to be horizontal to the base unit, and burring holes are provided at the horizontal unit and the base unit, respectively, so that center positions of the burring holes are arranged at a same position and that a diameter of the burring hole provided at the horizontal unit is larger than a diameter of the burring hole of the base unit, and the circuit board is mounted on the horizontal unit and/or the base unit.