Semiconductor device with a metallic carrier and two semiconductor chips applied to the carrier

Semiconductor device with a metallic carrier and two semiconductor chips applied to the carrier

A semiconductor device is disclosed. One embodiment provides a device including a carrier, an electrically insulating layer applied onto the carrier, an adhesive layer applied to the electrically insulating layer. A first semiconductor chip applied to the adhesive layer.

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Bibliographische Detailangaben
Hauptverfasser: MAHLER JOACHIM, FISCHER RUPERT, OTREMBA RALF, RAKOW BERND, ENGL REIMUND
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A semiconductor device is disclosed. One embodiment provides a device including a carrier, an electrically insulating layer applied onto the carrier, an adhesive layer applied to the electrically insulating layer. A first semiconductor chip applied to the adhesive layer.