Semiconductor device structure with strain layer and method of fabricating the semiconductor device structure

A semiconductor device with a strain layer and a method of fabricating the semiconductor device with a strain layer that can reduce a loading effect are provided. By arranging active dummies and gate dummies not to overlap each other, the area of active dummy on which a strain layer dummy will be fo...

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Bibliographische Detailangaben
Hauptverfasser: CHOI HYUN-MIN, LEE SEUNG-HWAN, WI SUNG-REY, MAEDA SHIGENOBU, WANGXIAO QUAN, SHIN HEON-JONG
Format: Patent
Sprache:eng
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Zusammenfassung:A semiconductor device with a strain layer and a method of fabricating the semiconductor device with a strain layer that can reduce a loading effect are provided. By arranging active dummies and gate dummies not to overlap each other, the area of active dummy on which a strain layer dummy will be formed can be secured, thereby reducing the loading effect.