Method for manufacturing semiconductor device and semiconductor device manufacturing system

A method for manufacturing a semiconductor device that controls the influence of a thickness of a stopper film even if there is a change in the thickness of the stopper film by measuring the thickness prior to etching to a predetermined thickness.

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Bibliographische Detailangaben
1. Verfasser: TERAHARA MASANORI
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A method for manufacturing a semiconductor device that controls the influence of a thickness of a stopper film even if there is a change in the thickness of the stopper film by measuring the thickness prior to etching to a predetermined thickness.