Method for assembling a carrier for integrated circuits

The invention relates to a method for assembling a carrier for integrated circuits. The carrier has upper and lower parts. The method includes the steps of positioning the lower part in a bottom clamp portion retained in a bottom clamp receptacle, positioning a top clamp portion in a top clamp recep...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: BERNARDI DAVID, O'FARRELL STEPHEN RICHARD, OSTE TOBY DESMOND, WASZCZUK JAN, GRANGER WILLIAM, JANOS MARK
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:The invention relates to a method for assembling a carrier for integrated circuits. The carrier has upper and lower parts. The method includes the steps of positioning the lower part in a bottom clamp portion retained in a bottom clamp receptacle, positioning a top clamp portion in a top clamp receptacle, the clamp portions being configured to engage each other in a locking manner, and positioning the upper part in a first gripper. The method also features the steps of applying adhesive to at least one of the parts, pressing said upper part onto the bottom part retained by the bottom clamp receptacle with the first gripper, whilst retrieving the top clamp portion with a second gripper, and locking the top clamp portion to the bottom clamp portion with the second gripper to clamp the parts together.