Inspection method for protecting image sensor devices with front surface protection

Inspection method for protecting image sensor devices with front surface protection

A method for inspecting a semiconductor wafer fabricated for image sensing operation that has had a transparent protective tape layer applied to a front or active wafer surface. The method includes quantifying chip defects in the image sensor wafer that lie under the protective layer using automatic...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KRYWANCZYK TIMOTHY C, NEARY TIMOTHY E, PROBSTFIELD ERIK M
Format: Patent
Sprache:eng
Schlagworte:
CALCULATING
COMPUTING
COUNTING
HANDLING RECORD CARRIERS
PHYSICS
PRESENTATION OF DATA
RECOGNITION OF DATA
RECORD CARRIERS
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Beschreibung
Zusammenfassung:A method for inspecting a semiconductor wafer fabricated for image sensing operation that has had a transparent protective tape layer applied to a front or active wafer surface. The method includes quantifying chip defects in the image sensor wafer that lie under the protective layer using automatic disposition equipment.