Method and structure for dispensing chip underfill through an opening in the chip

Method and structure for dispensing chip underfill through an opening in the chip

A method of making an integrated circuit package includes forming a through hole in an integrated circuit and assembling a die containing the integrated circuit on a carrier so that the die is mechanically and electrically connected to the carrier. Thereafter, an underfill material is dispensed betw...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: GERMANN PHILIP R, MAXSON MARK O, MAKI ANDREW B, BECKER DARRYL J, DAHLEN PAUL E, BARTLEY GERALD K
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A method of making an integrated circuit package includes forming a through hole in an integrated circuit and assembling a die containing the integrated circuit on a carrier so that the die is mechanically and electrically connected to the carrier. Thereafter, an underfill material is dispensed between the die and the carrier via the through hole.