Module housing for connecting opto-electronic sub-assemblies

This disclosure generally concerns modules. In one example, a module includes a housing, a printed circuit board, and an optical subassembly. The housing has a first part and a second part, with the second part holding the printed circuit board and optical subassembly. The printed circuit board has...

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Bibliographische Detailangaben
1. Verfasser: ROSENBERG PAUL K
Format: Patent
Sprache:eng
Schlagworte:
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