Module housing for connecting opto-electronic sub-assemblies
This disclosure generally concerns modules. In one example, a module includes a housing, a printed circuit board, and an optical subassembly. The housing has a first part and a second part, with the second part holding the printed circuit board and optical subassembly. The printed circuit board has...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | This disclosure generally concerns modules. In one example, a module includes a housing, a printed circuit board, and an optical subassembly. The housing has a first part and a second part, with the second part holding the printed circuit board and optical subassembly. The printed circuit board has a contact element located near one end of the printed circuit board. The optical subassembly includes a connector which has a free end. The free end of the connector and the contact element of the printed circuit board are pinched together when the first and second parts of the housing are joined, thus forming an electrical connection. |
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