Photo-resist material structure and method of producing the same

An apparatus includes a substrate and a photoresist material structure arranged adjacent to the substrate so that a cavity is formed between the substrate and the photoresist material structure. The cavity has an opening. The photoresist material structure includes a frame portion disposed on a main...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	WOERZ ANDREAS, STEINKIRCHNER ERWIN
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR MICROSTRUCTURAL TECHNOLOGY ORIGINALS THEREFOR PERFORMING OPERATIONS PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS TRANSPORTING
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Beschreibung
Zusammenfassung:	An apparatus includes a substrate and a photoresist material structure arranged adjacent to the substrate so that a cavity is formed between the substrate and the photoresist material structure. The cavity has an opening. The photoresist material structure includes a frame portion disposed on a main side of the substrate and a cap portion spanning over a part of the main side of the substrate at a distance to the main side. The cap portion is formed in the first photoresist layer and the frame portion is formed in the second photoresist layer.