Wafer level pre-packaged flip chip
A pre-packaged flip chip package that includes one or more dice on a semiconductor wafer is disclosed. In the various embodiments, an adhesive layer may be applied to a first side of a finished wafer, having connector pads formed thereon. The adhesive layer may include openings through which the con...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | A pre-packaged flip chip package that includes one or more dice on a semiconductor wafer is disclosed. In the various embodiments, an adhesive layer may be applied to a first side of a finished wafer, having connector pads formed thereon. The adhesive layer may include openings through which the connector pads may be accessed. Conductive elements may be positioned within the adhesive, and configured to electrically couple to the conductive elements. |
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