Wafer bonding material with embedded rigid particles

Wafer bonding material with embedded rigid particles

A material for bonding a lid wafer to a device wafer, which includes an adhesive substance with rigid particles embedded in the adhesive substance. The rigid particles may be particles or spheres of alumina, silica, or diamond, for example. The adhesive substance may be glass frit, epoxy, glue, ceme...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: SUMMERS JEFFERY F
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MICROSTRUCTURAL TECHNOLOGY
PERFORMING OPERATIONS
PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
SEMICONDUCTOR DEVICES
TRANSPORTING
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Beschreibung
Zusammenfassung:A material for bonding a lid wafer to a device wafer, which includes an adhesive substance with rigid particles embedded in the adhesive substance. The rigid particles may be particles or spheres of alumina, silica, or diamond, for example. The adhesive substance may be glass frit, epoxy, glue, cement or solder, for example. When the adhesive is applied and melted, and pressure is applied between the lid wafer and the device wafer, the lid wafer approaches the device wafer until a minimum separation is reached, which is defined by the rigid particles.