Formulation and method for depositing a material on a substrate

A formulation for depositing a material on a substrate, the formulation comprising the material to be deposited on the substrate dissolved in a solvent system comprising a first solvent component having a relatively high boiling point and which exhibits a relatively low solubility with respect to th...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	BRIGHT CHRISTOPHER J, CARTER JULIAN, CACHEIRO MARTIN, LYON PETER
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CALCULATING CHEMISTRY COMPUTING CORRECTION OF TYPOGRAPHICAL ERRORS COUNTING DYES ELECTRIC DIGITAL DATA PROCESSING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME LINING MACHINES MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PERFORMING OPERATIONS PHYSICS POLISHES PRINTING SELECTIVE PRINTING MECHANISMS SEMICONDUCTOR DEVICES STAMPS TRANSPORTING TYPEWRITERS
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Beschreibung
Zusammenfassung:	A formulation for depositing a material on a substrate, the formulation comprising the material to be deposited on the substrate dissolved in a solvent system comprising a first solvent component having a relatively high boiling point and which exhibits a relatively low solubility with respect to the material to be deposited, and a second solvent component having a relatively low boiling point and which exhibits a relatively high solubility with respect to the material to be deposited.