Attachment apparatus for electronic boards

Disclosed is an attachment apparatus. The attachment apparatus may facilitate attachment of various components to a printed circuit board (PCB) including a thermal management component.

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Bibliographische Detailangaben
Hauptverfasser: SUN XIAOHUA H, TONG RYAN C
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:Disclosed is an attachment apparatus. The attachment apparatus may facilitate attachment of various components to a printed circuit board (PCB) including a thermal management component.