Method and apparatus for sealing flex circuits made with an LCP substrate

A method and apparatus is disclosed for affixing a cover layer formed of liquid crystal polymer to a flex circuit consisting of circuit elements mounted to a liquid crystal polymer substrate in order to encapsulate the circuit elements between the cover layer and substrate to protect them from expos...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: SMITH C. W. SINJIN, NEWTON CHARLES M, JAYNES PAUL B
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:A method and apparatus is disclosed for affixing a cover layer formed of liquid crystal polymer to a flex circuit consisting of circuit elements mounted to a liquid crystal polymer substrate in order to encapsulate the circuit elements between the cover layer and substrate to protect them from exposure to moisture and contaminants.