Thermally stable and liquid-tight joint between a first ceramic, metal, or plastic component and a second ceramic, metal or plastic component, and the use of one such joint

The invention relates to a joint which can be subjected to the temperature influences of an external medium (20) and joins an especially ceramic component (2) to an especially metallic component (1). Said joint consists of a first adhesive joint (14) between the metallic component and the ceramic co...

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Bibliographische Detailangaben
Hauptverfasser:	HECKELMANN GERD, MUHL MIKE, HALL JUERGEN, OSWALD HEINZ, DERR ANDREAS
Format:	Patent
Sprache:	eng
Schlagworte:	ARTIFICIAL STONE CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CEMENTS CERAMICS CHEMISTRY COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS CONCRETE ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS LIME, MAGNESIA MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS REFRACTORIES SLAG TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TREATMENT OF NATURAL STONE
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Beschreibung
Zusammenfassung:	The invention relates to a joint which can be subjected to the temperature influences of an external medium (20) and joins an especially ceramic component (2) to an especially metallic component (1). Said joint consists of a first adhesive joint (14) between the metallic component and the ceramic component, and a second adhesive joint (22), the adhesive (16) of the second joint having a higher elasticity than that (10) of the first adhesive joint (14), and the second joint being arranged in such a way that it prevents direct contact between the first adhesive joint (14) and an external medium (20). The inventive joint can preferably be used, for example, preferably in a sensor module of a measuring appliance which can be introduced into a medium to be analyzed.