Apparatus for attaching a peeling tape

In a peeling tape attaching apparatus for attaching a peeling tape (4) on a surface protective film (11) attached on the surface of a wafer (20), the wafer is supported on a movable table (31) with the surface protective film up and the peeling tape is supplied on the surface protective film of the...

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Bibliographische Detailangaben
1. Verfasser:	AMETANI MINORU
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	In a peeling tape attaching apparatus for attaching a peeling tape (4) on a surface protective film (11) attached on the surface of a wafer (20), the wafer is supported on a movable table (31) with the surface protective film up and the peeling tape is supplied on the surface protective film of the wafer. The movable table is moved in such a manner that an end (28) of the wafer is located under a peeling tape attaching unit (46), and pressure is exerted by pressing the peeling tape attaching unit against the surface protective film of the wafer via the peeling tape. After that, the movable table is moved toward the other end (29) of the wafer, and upon movement of the movable table, by a predetermined distance, from the peeling tape attaching unit, the pressure is canceled.