Method for coating a multilayer film and product having a multilayer coated film

A method of applying a multilayer coating film, in which two or more layers of coating film are applied to a flat plate, such as steel plate, by baking finish, which method is effective for preventing of foam generation; and a product with multilayer coating film obtained by the method. There is pro...

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Bibliographische Detailangaben
Hauptverfasser:	TOBISAWA KATSUNORI, SUEMUNE YOSHIHIRO, NAGASE MAGONORI, FURUKAWA HIROYASU
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS PERFORMING OPERATIONS PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL SPRAYING OR ATOMISING IN GENERAL TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TRANSPORTING
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Beschreibung
Zusammenfassung:	A method of applying a multilayer coating film, in which two or more layers of coating film are applied to a flat plate, such as steel plate, by baking finish, which method is effective for preventing of foam generation; and a product with multilayer coating film obtained by the method. There is provided a method of applying a multilayer coating film, including discharging paint films through multiple slits, simultaneously applying these films to a traveling plate to thereby form a multilayer paint film and carrying out drying or baking thereof, characterized in that with respect to the boiling points of solvents contained in adjacent layers of the multilayer paint film, there is such a relationship that the boiling point of solvent contained in the layer close to the plate is equivalent to or lower than the boiling point of solvent contained in the layer remote from the plate, and that the boiling point of solvent contained in the layer closest to the plate is lower than the boiling point of solvent contained in the layer remotest from the plate.