Bonding an interconnect to a circuit device and related devices

This disclosure relates to a system and method for bonding an interconnect to a dense circuit device with a mechanically clamping substrate.

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Bibliographische Detailangaben
Hauptverfasser:	YENCHIK RONNIE, MEYER NEAL, HELLEKSON RONALD
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	This disclosure relates to a system and method for bonding an interconnect to a dense circuit device with a mechanically clamping substrate.