Electronic circuit package

An electronic apparatus which includes a wiring substrate which includes wiring conductors, and a plurality of semiconductor bare chips that are formed on the wiring substrate. The semiconductor bare chips include a processor for processing data and a circuit having a checking function for detecting...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: IHARA HIROKAZU, OKISHIMA TETSUYA, AKIYAMA MASATSUGU, KAWABATA KIYOSHI, YAMANAKA HISAYOSHI, KANEKAWA NOBUYASU
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:An electronic apparatus which includes a wiring substrate which includes wiring conductors, and a plurality of semiconductor bare chips that are formed on the wiring substrate. The semiconductor bare chips include a processor for processing data and a circuit having a checking function for detecting faults of the processor.