Chip package for image sensor and method of manufacturing the same

A chip package for an image sensor includes a first semiconductor chip having a first surface where a photographing device and a first circuit pattern are formed and a second surface that is opposite to the first surface where a second circuit pattern is formed. The first and second circuit patterns are electrically connected. The chip package further includes a second semiconductor chip attached to a second circuit pattern on the second surface of the first semiconductor chip. A printed circuit board faces the second surface of the first semiconductor chip and transfers an electric signal between the first and second semiconductor chips and externally. A housing accommodates the first and second semiconductor chips. The housing allows light to pass through to the photographing device.