Integrated circuit package system with arched pedestal

Integrated circuit package system with arched pedestal

An integrated circuit package system includes an arched pedestal integrated circuit die including an active surface, a die mounting surface, a pedestal portion including an arch intersecting the die mounting surface and having an arch height, and the arch under a portion of the active surface and ha...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: PARK SOO-SAN
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:An integrated circuit package system includes an arched pedestal integrated circuit die including an active surface, a die mounting surface, a pedestal portion including an arch intersecting the die mounting surface and having an arch height, and the arch under a portion of the active surface and having an arch width less than the arch height.