Photolithographic method and apparatus employing a polychromatic mask
A photolithographic method and associated apparatus are provided that permit three-dimensional structures to be defined in a photoresist coating in such a manner that multi-level structures can be formed which have constant width at different depths within the photoresist coating. The photolithograp...
Gespeichert in:
1. Verfasser: | |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | A photolithographic method and associated apparatus are provided that permit three-dimensional structures to be defined in a photoresist coating in such a manner that multi-level structures can be formed which have constant width at different depths within the photoresist coating. The photolithographic method and apparatus may permit such three-dimensional structures to be defined within a photoresist coating with the use of a single polychromatic mask and, optionally, a micro-lens array. By designing the polychromatic mask to have a plurality of regions that selectively pass and block respective wavelengths of light, the photoresist coating can be selectively illuminated with light have different wavelengths. As a result of the optical absorption characteristics of the photoresist coating, the different wavelengths of light propagate to different depths within the photoresist coating, thereby defining multi-level microstructures therein. |
---|