Through-wafer interconnects for photoimager and memory wafers

Through-wafer interconnects for photoimager and memory wafers

A through-wafer interconnect for imager, memory and other integrated circuit applications is disclosed, thereby eliminating the need for wire bonding, making devices incorporating such interconnects stackable and enabling wafer level packaging for imager devices. Further, a smaller and more reliable...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: FARNWORTH WARREN M, KIRBY KYLE K, VELICKY LU, AKRAM SALMAN, OLIVER STEVEN D, HEMBREE DAVID R, HIATT WILLIAM M, TUTTLE MARK E, WOOD ALAN G, RIGG SIDNEY B, WATKINS CHARLES M, WARK JAMES M
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A through-wafer interconnect for imager, memory and other integrated circuit applications is disclosed, thereby eliminating the need for wire bonding, making devices incorporating such interconnects stackable and enabling wafer level packaging for imager devices. Further, a smaller and more reliable die package is achieved and circuit parasitics (e.g., L and R) are reduced due to the reduced signal path lengths.