Semiconductor package with bypass capacitor

Semiconductor package with bypass capacitor

A semiconductor package comprises a substrate, which has two surfaces and comprises first and second electrical paths. On one of the surfaces, a semiconductor chip is mounted. The semiconductor chip comprises a plurality of pads, which include a first pad to be supplied with a power supply and a sec...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: ISA SATOSHI, OSANAI FUMIYUKI, TOMOYAMA TSUYOSHI, YAMAGUCHI MASAHIRO, SUGANO TOSHIO, HIRAISHI ATSUSHI, SHIBAMOTO MASANORI
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A semiconductor package comprises a substrate, which has two surfaces and comprises first and second electrical paths. On one of the surfaces, a semiconductor chip is mounted. The semiconductor chip comprises a plurality of pads, which include a first pad to be supplied with a power supply and a second pad to be grounded. On the other surface, at least one bypass capacitor is mounted. The bypass capacitor comprises first and second terminals, which are connected to the first and the second pads through the first and the second electrical paths, respectively.