Semiconductor chip mounting substrate, semiconductor chip mounting body, semiconductor chip stacked module, and semiconductor chip mounting substrate manufacturing method

Semiconductor chip mounting substrate, semiconductor chip mounting body, semiconductor chip stacked module, and semiconductor chip mounting substrate manufacturing method

There is provided a semiconductor chip mounting substrate including a substrate on which a mounting region for mounting a semiconductor chip and a connection region for interlayer connection of the semiconductor chip are formed, and a plurality of alignment marks for alignment at the time of stackin...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: NAKAHASHI AKIHISA, MAEGAWA YUKIHIRO, SUZUKI NAOKI
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:There is provided a semiconductor chip mounting substrate including a substrate on which a mounting region for mounting a semiconductor chip and a connection region for interlayer connection of the semiconductor chip are formed, and a plurality of alignment marks for alignment at the time of stacking which are provided around or in the connection region on the substrate, wherein a reinforcing member as a reinforcing region for reinforcing a portion between the plurality of alignment marks is provided on the substrate.