Wafer, semiconductor chip, and semiconductor device

Scribe lines demarcating semiconductor chips comprise, in both the vertical direction and the horizontal direction, first-type scribe lines of the minimum width enabling cutting by dicing or other means, and second-type scribe lines enabling placement of TEGs, alignment marks or other accessories, and a placement pattern is set so that a unit cell which can be exposed in a single shot comprises one second-type scribe line. By this means, the area occupied by scribe lines can be reduced. Further, by decreasing the number of placement of semiconductor chips constituting a unit cell, and by cutting substantially along the center line of second-type scribe lines, the shapes of scribe lines on the periphery of semiconductor chips can be changed, so that the position in the unit cell can be determined.