Method for producing a fiber-reinforced composite material plate

A method for producing a fiber-reinforced composite material plate by heating and pressurizing a prepreg for a molding time of 15 minutes or less, at a molding temperature of at least 120° C. and a molding pressure of at least 10 kg/cm2. The prepreg is prepared from a reinforcing fiber and an epoxy...

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Bibliographische Detailangaben
Hauptverfasser:	NUMATA KIHARU, ITO AKIHIRO, TAGUCHI MASATO, YANASE AKITADA, GOTO KAZUYA, MURAMATSU JUNICHI, TAKANO TSUNEO, SAKAI TADASHI, KOGA KAZUKI
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS GENERAL PROCESSES OF COMPOUNDING LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL WORKING-UP
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Beschreibung
Zusammenfassung:	A method for producing a fiber-reinforced composite material plate by heating and pressurizing a prepreg for a molding time of 15 minutes or less, at a molding temperature of at least 120° C. and a molding pressure of at least 10 kg/cm2. The prepreg is prepared from a reinforcing fiber and an epoxy resin composition. The epoxy resin composition features: an epoxy resin; an amine compound having at least one sulfur atom in the molecule thereof and/or a reaction product of the epoxy resin and the amine compound having at least one sulfur atom in the molecule thereof; a urea compound; and a dicyandiamide. The contents of the sulfur atom and the urea compound in the epoxy resin composition are respectively 0.2 to 7% by mass and 1 to 15% by mass.