IC socket

An IC socket for receiving an IC package includes a socket body with a plurality of contacts disposed therein, a lid mounted on the socket body and movable relative to the socket body in an up-down direction, and a pressing mechanism driven by the lid. The pressing mechanism has a pusher able to app...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: HSU HSIU-YUAN, KENZO NAKAO
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:An IC socket for receiving an IC package includes a socket body with a plurality of contacts disposed therein, a lid mounted on the socket body and movable relative to the socket body in an up-down direction, and a pressing mechanism driven by the lid. The pressing mechanism has a pusher able to apply a substantial balanced force to the IC package, and thus any distortion of the IC package will be prevented effectively.