Method of manufacturing thin-film electronic device having a through-hole extending through the base and in communicative connection with an opening in the electrically conductive layer

Method of manufacturing thin-film electronic device having a through-hole extending through the base and in communicative connection with an opening in the electrically conductive layer

A method of manufacturing a thin-film electronic device comprising providing a dielectric layer on a base, providing a first electrically conductive layer having a first opening and covering at least part of the dielectric layer; and forming a first through-hole extending through the base and commun...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: SHIBUE AKIRA, SHINOURA OSAMU, OZAKI YUMIKO, KOMURO EIJU
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A method of manufacturing a thin-film electronic device comprising providing a dielectric layer on a base, providing a first electrically conductive layer having a first opening and covering at least part of the dielectric layer; and forming a first through-hole extending through the base and communicating with the first opening. A second electrically conductive layer may be provided on the base, and a dielectric layer may be provided so as to cover at least part of this second conductive layer.