Method and apparatus for testing integrated circuits for susceptibility to latch-up

In an example embodiment, there is a test module for testing the susceptibility of an integrated circuit design to latch-up. The test module comprises a plurality of test blocks, connected in parallel. Each test block includes an injector block for applying a stress current of voltage to the respective test block and a plurality of sensor blocks located at successively increasing distances from the respective injector block. Each sensor block includes a PNPN latch-up test structure. The present invention combines the respective advantages of IC stress current testing and latch-up parameter measurement using a standard PNPN latch-up test structure.