Method for selective removal of a layer

A method for forming a semiconductor device includes forming a liner over a semiconductor material including a control electrode. The method further includes forming a first spacer adjacent to the control electrode, wherein the first spacer has a first width. The method further includes implanting c...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: JAWARANI DHARMESH, NAGY ANDREW G, LOIKO KONSTANTIN V
Format: Patent
Sprache:eng
Schlagworte:
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