Method and apparatus for manufacturing and probing test probe access structures on vias

Method and apparatus for manufacturing and probing test probe access structures on vias

One or more test probe access structures for accessing vias on a printed circuit assembly and method of fabrication thereof is presented. Each test probe access structure is conductively connected to a via at a test probe access location above an exposed surface of a via to be accessible for probing...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: LEINBACH GLEN E, PARKER KENNETH P
Format: Patent
Sprache:eng
Schlagworte:
MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
PHYSICS
TESTING
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Beschreibung
Zusammenfassung:One or more test probe access structures for accessing vias on a printed circuit assembly and method of fabrication thereof is presented. Each test probe access structure is conductively connected to a via at a test probe access location above an exposed surface of a via to be accessible for probing by a test probe.